By J. Shields (Auth.)
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Assembly within 10 min where cooling of hot glue leads to premature setting. Setting process Loss of water and gelation. Processing conditions Dependent on type of glue. Set at room or high temperatures (8O-90°C). Bonds form before glue cools and gels. Bonding pressures range from contact to 1000-1400 kPa (hardwoods) and 350-700 kPa (softwoods) and are applied for 5 min to several hours. For wood, moisture content should not exceed 18%. Coverage 2 0-1-0-15 kg/m . ADHESIVE MATERIALS AND PROPERTIES Permanence Generally resistant to organic solvents but do not withstand exposure to water, weather, heat or bacterial growths in humid conditions.
Impermeable materials are coated with adhesive and bonded together only after the bulk of the solvent has been dried off to leave the adhesive in a tacky state. Light assemblies can frequently be handled after a few hours but heavier assemblies require a setting period of at least 24 h. Maximum joint strength is not realised until after a few days following the removal of residual solvent traces. Wet-bonding generally produces joints having good strength and durability but poor solvent resistance.
For porous materials, several minutes at 80°C. Coverage 2 0-05-1-5 kg/m . Permanence Good resistance to boiling water but subject to biodeterioration and attack by insects. Ageing prop- 37 Closed assembly time, 20°C 10-20 min for wet bonding. Setting process Solvent release from adhesive coated adherends and contact bonding of the tacky surface. Processing conditions Removal of bulk of solvent by evaporation for 20 min to several hours (may be assisted by warm air drying) followed by low pressure contact bonding.