Download Characterization of Integrated Circuit Packaging Materials by Thomas Moore PDF

By Thomas Moore

Chapters during this quantity deal with vital features of IC programs. Analytical suggestions applicable for IC package deal characterization are validated via examples of the size of serious functionality parameters and the research of key technological difficulties of IC programs. concerns are mentioned which impact a number of package deal forms, together with plastic surface-mount programs, airtight programs, and complex designs akin to flip-chip, chip-on-board and multi-chip models.

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Moisture also has a very significant effect on adhesion, but this topic is discussed in the Moisture Absorption and Its Effect on Adhesion subsection. Effects of Lead Frame Oxides Lead frames are quite often subjected to high temperature for a prolonged time during assembly operations such as die attachment and wire bond ball joint for­ mations. These operations cause some lead frame oxidation, especially on lead frames with Cu as the base metal. These oxide layer formations present an addi­ tional challenge because the surface oxide layer alters the surface energetics.

1992, p. 251. 2 R. Milburn and K. Rackley. "New Technology in Electronic Packaging," ASM International. 11, 1990. 3 C. M. Vicroy, J. H. Linn, and R. W. Belcher. International Sym. for Testing and Failure Analysis. 1990, p. 149. 4 T. A. Anderson and K. L. Evans. International Sym. for Testing and Failure Analysis. 1986, p. 17. 5 H. Moltzan and G. Bednarz. Texas Instruments Technical Journal. /Oct. 1988. 6 D. Danielson, G. Marcyk, E. Babb, and S. Kudva. 27th International Reliability Physics Sym.

It clearly shows the impact of different catalysts on the cure rate as well as on the resultant 71.

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