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Download Handbook of 3D Integration: Volumes 1 and 2 - Technology and by Philip Garrou, Christopher Bower, Peter Ramm PDF

By Philip Garrou, Christopher Bower, Peter Ramm

The 1st encompassing treatise of this new and extremely vital box places the identified actual obstacles for traditional second microelectronics
into point of view with the necessities for additional microelectronics advancements and industry prerequisites. This two-volume handbook
provides 3D options to the function density challenge, addressing all vital concerns, akin to wafer processing, die bonding, packaging
expertise, and thermal facets. It starts off with an introductory half, which defines beneficial ambitions, current matters and relates 3D integration
to the semiconductor roadmap of the undefined. prior to happening to hide processing know-how and 3D constitution fabrication recommendations in
aspect. this can be by means of fields of program and a glance on the way forward for 3D integration.

The editors have assembled contributions from key educational and commercial avid gamers within the box, together with Intel, Micron, IBM, Infineon,
Qimonda, NXP, Philips, Toshiba, Semitool, EVG, Tezzaron, Lincoln Labs, Fraunhofer, RPI, IMEC, CEA-LETI etc

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Additional resources for Handbook of 3D Integration: Volumes 1 and 2 - Technology and Applications of 3D Integrated Circuits

Sample text

2 UMC UMC announced in the spring of 2011 that it had acquired production equipment for TSV and other 3D IC technologies. In 2013 UMC and STATS ChipPAC announced a jointly developed TSV-enabled 3D IC chip stack consisting of a Wide I/O memory test chip stacked upon a TSV-embedded 28 nm processor test chip [13]. 3 GlobalFoundries GlobalFoundries (GF) announced installation of TSV production tools for 20 nm technology wafers in their Fab 8 New York facility. The first full-flow silicon with TSVs was expected to start running in the third quarter of 2012 [14].

Html (accessed manufacturing convergence: going vertical. December 31, 2013). 11 Solid State Technology (2012) Will the $2 SEMICON Taiwan, 3D IC Technology interposer be silicon or glass? Available at Forum. com/articles/ap/2012/ up in 1Q13 top 20 Semi supplier ranking. html (accessed December 31, 2013). 12 Micronews Media (2012) Are silicon news/bulletins/Eleven-Companies-Moveinterposers “luxury” solutions? com/upload/pdf/ Ranking/ (accessed December 31, 2013). Garrou, P. , Solid (accessed December 31, 2013).

S. 8 GB/s 2 Gb mobile wide-I/O DRAM with 4_128 I/O’s using TSV-based stacking. IEEE ISSCC. Jeddeloh, J. and Keeth, B. (2012) New DRAM architecture increases density and performance. 2012 Symposium on VLSI Technology, p. 87. T. (2011) Hybrid memory cube: breakthrough DRAM performance with a fundamentally re-architected DRAM subsystem. Proceedings of the 23rd Hot Chips Symposium. Suh, M. (2013) TSV application in memory devices. RTI 3D Architectures for Semiconductor Integration and Packaging Conference, Burlingame CA, December 2013.

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